DirectFET™ Power PackagingElectronic Products 2002 Product of the Year |
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FEATURES AT A GLANCE
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DC-DC Converters Operating At Up to 2MHz…more |
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THE IR ADVANTAGE
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APPLICATIONS
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The DirectFET™ power package is a breakthrough surface-mount power MOSFET packaging technology designed for efficient top-side cooling in an SO-8 footprint. In combination with improved bottom-side cooling, the new package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or derivative SO-8 packages. This effectively doubles current density (A/in2) at a lower total system cost. The first offerings in this new package are matched 20V (IRF6601, IRF6602) and 30V (IRF6603, IRF6604) synchronous buck converter MOSFET chipsets.more… | |||||||||||||||||||||||||||||||||||||||||||
SPECIFICATIONS | |||||||||||||||||||||||||||||||||||||||||||
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Trade Press Coverage“Dual Thermal Paths Double Power Handling For Surface-Mount MOSFETs” Featured in Electronic Design
Technical Paper High Current Voltage Regulator Module Emplys Novel Packaging Technology to Achieve Over 100A in a Compact Footprint to Power Next Generation Servers PDF DirectFET™ – A Proprietary New Source Mounted Power Package for Board Mounted Power PDF Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors PDF Evaluation of Power MOSFET Thermal Solutions for Desktop and Mobile Processor Power PDF |
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Application Note
DirectFET™ Technology: Board Mounting Guidlines PDF |
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