Packaging

Package Information
  • Bridge rectifiers
  • Diodes
  • Modules
  • Thyristors
  • Control Integrated Circuits
  • LDO Voltage Regulators
  • Switching & Linear Controllers
  • Power MOSFETs
  • IGBTs
  • Inverter SCR
  • FETKY™ devices
  • Intelligent Power Switch
  • MERs
  • Hi-Rel Devices

Application Notes

  • Lead Bending and Soldering Considerations for International Rectifier’s Power Semiconductor Packages
  • ADD-A-Pak Module Mounting Instructions
  • Surface Mounting of Larger Devices
  • Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration
  • Mounting Considerations for International Rectifier’s Power Semiconductor Packages
  • PowIRtab™ Mounting Guidelines
  • Mounting Guidelines for the Super-220™
  • Mounting Guidelines for the Super-247™
  • Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors

For more information:
Contact the Technical Assistance Center or your local Sales Rep.